View IPF09N03LBG_5073656.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g opti mos ? 2 power-transistor features ? ideal for high-frequency dc/dc converters ? qualified according to jedec 1) for target applications ? n-channel, logic level ? excellent gate charge x r ds(on) product (fom) ? superior thermal resistance ? 175 c operating temperature ? pb-free lead plating; rohs compliant maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25 c 2) 50 a t c =100 c 42 pulsed drain current i d,pulse t c =25 c 3) 200 avalanche energy, single pulse e as i d =50 a, r gs =25 ? 57 mj reverse diode d v /d t d v /d t i d =50 a, v ds =20 v, d i /d t =200 a/s, t j,max =175 c 6 kv/s gate source voltage 4) v gs 20 v power dissipation p tot t c =25 c 58 w operating and storage temperature t j , t stg -55 ... 175 c iec climatic category; din iec 68-1 55/175/56 value v ds 30 v r ds(on),max 9.1 m ? i d 50 a product summary type ipd09n03lb g ips09n03lb g ipf09n03lb g ipu09n03lb g package pg-to252-3-11 pg-to251-3-11 pg-to252-3-23 pg-to251-3-1 ordering code available on request on request on request marking 09n03lb 09n03lb 09n03lb 09n03lb rev. 1.4 page 1 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - case r thjc - - 2.6 k/w smd version, device on pcb r thja minimal footprint - - 75 6 cm 2 cooling area 5) --50 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0 v, i d =1 ma 30 - - v gate threshold voltage v gs(th) v ds = v gs , i d =20 a 1.2 1.6 2 zero gate voltage drain current i dss v ds =30 v, v gs =0 v, t j =25 c - 0.1 1 a v ds =30 v, v gs =0 v, t j =125 c - 10 100 gate-source leakage current i gss v gs =20 v, v ds =0 v - 10 100 na drain-source on-state resistance r ds(on) v gs =4.5 v, i d =25 a - 11.6 14.4 m ? v gs =4.5 v, i d =25 a, smd version - 11.4 14.2 v gs =10 v, i d =50 a - 7.6 9.3 v gs =10 v, i d =50 a, smd version - 7.4 9.1 gate resistance r g -1- ? transconductance g fs | v ds |>2| i d | r ds(on)max , i d =50 a 31 61 - s 5) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. values 2) current is limited by bondwire; with an r thjc =2.6 k/w the chip is able to carry 59 a. 3) see figure 3 4) t j,max =150 c and duty cycle d <0.25 for v gs <-5 v 1) j-std20 and jesd22 rev. 1.4 page 2 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 1200 1600 pf output capacitance c oss - 440 590 reverse transfer capacitance c rss -5988 turn-on delay time t d(on) - 7 11 ns rise time t r -58 turn-off delay time t d(off) -2030 fall time t f - 3.0 5 gate char g e characteristics 6) gate to source charge q gs -46nc gate charge at threshold q g(th) - 2.0 2.6 gate to drain charge q gd - 2.6 4 switching charge q sw -57 gate charge total q g -1013 gate plateau voltage v plateau - 3.4 - v gate charge total, sync. fet q g(sync) v ds =0.1 v, v gs =0 to 5 v - 8 11 nc output charge q oss v dd =15 v, v gs =0 v -1013 reverse diode diode continous forward current i s - - 48 a diode pulse current i s,pulse - - 350 diode forward voltage v sd v gs =0 v, i f =48 a, t j =25 c - 0.96 1.2 v reverse recovery charge q rr v r =15 v, i f = i s , d i f /d t =400 a/s - - 10 nc 6) see figure 16 for gate charge parameter definition t c =25 c values v gs =0 v, v ds =15 v, f =1 mhz v dd =15 v, v gs =10 v, i d =25 a, r g =2.7 ? v dd =15 v, i d =25 a, v gs =0 to 5 v rev. 1.4 page 3 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g 1 power dissipation 2 drain current p tot =f( t c ) i d =f( t c ); v gs 10 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t c =25 c; d =0 z thjc =f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 10 ms dc 1 10 100 1000 0.1 1 10 100 v ds [v] i d [a] limited by on-state resistance single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 0.001 0.01 0.1 1 10 0000001 t p [s] z thjc [k/w] 0 10 20 30 40 50 60 0 50 100 150 200 t c [c] p tot [w] 0 20 40 60 0 50 100 150 200 t c [c] i d [a] rev. 1.4 page 4 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c parameter: t j 3.5 v 3.8 v 4.1 v 4.5 v 10 v 0 2 4 6 8 10 12 14 16 18 20 0 20406080100 i d [a] r ds(on) [m ? ] 25 c 175 c 0 20 40 60 80 100 012345 v gs [v] i d [a] 0 10 20 30 40 50 60 70 0 102030405060 i d [a] g fs [s] 2.8 v 3 v 3.2 v 3.5 v 3.8 v 4.1 v 4.5 v 10 v 0 10 20 30 40 50 60 70 80 90 100 0123 v ds [v] i d [a] rev. 1.4 page 5 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =50 a; v gs =10 v v gs(th) =f( t j ); v gs = v ds parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz i f =f( v sd ) parameter: t j typ 98 % 0 2 4 6 8 10 12 14 16 18 20 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ? ] 20 a 200 a 0 0.5 1 1.5 2 2.5 -60 -20 20 60 100 140 180 t j [c] v gs(th) [v] ciss coss crss 10 100 1000 10000 0 5 10 15 20 25 30 v ds [v] c [pf] 25 c 175 c 25 c, 98% 175 c, 98% 1 10 100 1000 0.0 0.5 1.0 1.5 2.0 v sd [v] i f [a] rev. 1.4 page 6 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g 13 avalanche characteristics 14 typ. gate charge i as =f( t av ); r gs =25 ? v gs =f( q gate ); i d =25 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage 16 gate charge waveforms v br(dss) =f( t j ); i d =1 ma 6 v 15 v 24 v 0 2 4 6 8 10 12 0 5 10 15 20 q gate [nc] v gs [v] 20 22 24 26 28 30 32 34 36 38 -60 -20 20 60 100 140 180 t j [c] v br(dss) [v] v gs q gate v gs(th) q g(th) q gs q gd q sw q g 25 c 100 c 150 c 1 10 100 1 10 100 1000 t av [s] i av [a] rev. 1.4 page 7 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g package outline pg-to252-3-11 pg-to252-3-11: outline footprint: packaging: rev. 1.4 page 8 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g package outline pg-to252-3-23 pg-to252-3-23: outline footprint: rev. 1.4 page 9 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g package outline pg-to251-3-11 pg-to251-3-11: outline pg-to251-3-21: outline rev. 1.4 page 10 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g package outline pg-to251-3-21 pg-to251-3-11: outline pg-to251-3-21: outline rev. 1.4 page 11 2006-01-12
ipd09n03lb g ips09n03lb g ipu09n03lb g ipf09n03lb g published by infineon technologies ag bereich kommunikation st.-martin-stra?e 53 d-81541 mnchen ? infineon technologies ag 1999 all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as warranted characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. infineon technologies is an approved cecc manufacturer. information for further information on technology, delivery terms and conditions and prices, please contact your nearest infineon technologies office in germany or our infineon technologies representatives worldwide (see address list). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact your nearest infineon technologies office. infineon technologies' components may only be used in life-support devices or systems with the expressed written approval of infineon technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.4 page 12 2006-01-12

▲Up To Search▲

Price & Availability of IPF09N03LBG

	To Download IPF09N03LBG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .